A Platform for Three-Dimensional On-chip Photonics: Multi-bonded Silicon-On-Insulator wafers

TitleA Platform for Three-Dimensional On-chip Photonics: Multi-bonded Silicon-On-Insulator wafers
Publication TypeJournal Article
Year of Publication2011
AuthorsHosseini A, Fallahazad B, Kwong DN, Zhanag Y, Tutuc E, Chen RT
JournalOSA/CLEO 2011 Laser Application to Photonic Applications paper
VolumeCThHH5